Silicon Artist IC Production Consulting services includes
post production capabilities including: testing, analysis, and reliability
qualification services. We are capable of providing turn-key FA
analysis, testing and qualifications for large projects or accomplishing
single event analysis services. IC Manufacturing outsourcing is
the solution for fabless and IDM semiconductor companies looking
to reduce cost, time, and overhead.
Silicon Artist is pleased to provide
the following post production services:
Reliability Qualification Testing
The purpose of reliability testing is to ensure that products are
properly designed and assembled by subjecting them to stress conditions
that accelerate potential failure mechanisms. Reliability test methods
are defined in many industrial standards, such as MIL-STD-883 and
JEDEC STD-22.
Silicon Artist provides for the following
reliability qualification test services:
* HAST (Highly Accelerated Temperature and Humidity Stress Test)
* Thermal Shock (Liquid to Liquid)
* Autoclave or Pressure Cooker Test
* Temperature Cycling (TC) Air to Air
* Temperature Humidity Bias Lifetest 85C/85%
* Humidity-Bias Test (THB)
* HTOL (High Temperature Operating Lifetest) / Burn-in
* High-Temperature Storage Life Test (HTSL)
* Bias Life Test (BLT)
* Preconditioning
* Real Time Thermal Profiling
* Solderability
* Fine and Gross Leak Testing (Seal)
ESD and Latch-up Testing
Silicon Artist can support any post
manufacturing ESD and Latch-up testing requirements. In addition
to reliability testing, we can provide ESD and Latch-up failure
analysis to identify events and point of entry using the latest
in fault isolation techniques, including:
* Human Body Model (HBM) testing
* Machine Model (MM) testing
* Charged Device Model (CDM) testing
* Latch-up testing
FIB Circuit Modifications
Silicon Artist is with you throughout
your IC project. Even if ever the unthinkable interferes with you
project schedule. The FIB systems we work diligently to never have
to use provide for platinum metal deposition, dielectric insulator
deposition, and enhanced etch chemistries. If needed we can provide
for:
Circuit Modifications - Copper and latest geometry technology modifications.
Cut and jump IC modification is a cost efficient method to debug
and make design changes prior to re-masking.
Probe Pads - Deposit probe points for electrical characterization
that are not accessible via conventional probing techniques.
Wire Bond Pads - Deposit wire bonding pads for high current modifications.
Precision Cross Sections - Perform precision cross sections with
sub micron accuracy. Cross section photo resist, MEMS, and biological
structures that do not lend themselves to conventional mechanical
cross section techniques.
TEM sample preparation - Thin cross section samples for subsequent
TEM imaging.
Failure Analysis
* Device Level FA
* System Level FA
* Light Emission Microscopy (LEM)
* Thermal Infrared Imaging
* Externally Induced Voltage Alterations (XIVA)
* Transmission Line Pulse Testing (TLP)
* DC Characterization
* Mechanical Microprobe
* Scanning Electron Microscopy (SEM)
* Energy Depressive Spectroscopy (EDS)
* High Resolution Real Time X-ray Imaging
* High Resolution Scanning Acoustic Microscopy (SAM)
* Wire Bond and Solder Ball Bond Strength Testing
* Device Construction Analysis
* Sample Preparation Services
- Backside Sample Milling
- Parallel Lapping
- Cross-section
- Device Decapsulation
- Plasma Etching
- Laser Cutting
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